Koch Chemie Polishing & Sealing Pad

KochChemie Polishing & Sealing Pad Extra-fine finish sponge for economically and evenly applying sealing products. The short height of 23mm creates low torsion forces, excellent handling and the highest level of stability. The optimized reticulation (open cellular structure) and cell count contribute to excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety. Compression hardness: 4. Abrasiveness: 2.